We are pleased to invite you to submit your research papers to the 5th Joint International Conference on Nanobioscience & Nanoengineering (BOND21 2026), which will be held as follows:
Date : 30 September – 1 October 2026
Venue : Bangi Resort Hotel, Selangor, Malaysia
Theme : Nanobioscience and Nanoengineering for Nation’s Growth & Sustainability
BOND21 2026 welcomes original research contributions in (but not limited to) the following areas:
| Nanobioscience | Nanoengineering |
| Simulation & Design | Device Fabrication |
| Fabrication & Synthesis | Process Technology |
| Biotech & Physics | Nanomaterial Testing |
| Semiconductors & Sensors | Nanoelectronics Engineering |
| Renewable Energy & Thin Films | System Integration |
Important Dates
· Full Manuscript Submission: 15 July 2026
· Notification of Acceptance: 1 August 2026
· Camera-ready Submission: 7 August 2026
· Registration & Payment Deadline: 15 August 2026
Registration Fees
· Local Participant: RM 1,100
· International Participant: USD 375
All accepted papers will be submitted for publication in Scopus-indexed proceedings. Selected high-quality papers will be considered for publication in a Special Issue of the International Journal of Nanoelectronics and Materials (IJNeaM)(Web of Science indexed).
For submission guidelines and further information, please visit https://bond21.unimap.edu.my
We sincerely look forward to your valuable contribution and participation in BOND21 2026.
