Editor, Author at Institute of Nano Electronic Engineering

Highly sensitive silicon nanowire biosensor with novel liquid gate control for detection of specific single-stranded DNA molecules

June 25, 2015 By Editor

Abstract – The study demonstrates the development of a liquid-based gate-control silicon nanowire biosensor for detection of specific single-stranded DNA (ssDNA) molecules. The sensor was fabricated using conventional photolithography coupled with an inductively coupled plasma dry etching process. Prior to the application of DNA to the device, its linear response to pH was confirmed by serial dilution from pH 2 to pH14. Then, the sensor surface was silanized and directly aminated with (3-aminopropyl) triethoxysilane to create a molecular binding chemistry for biofunctionalization. The resulting Si‒O‒Si‒ components were functionalized with receptor ssDNA, which interacted with the targeted ssDNA to create a field across the silicon nanowire and increase the current. The sensor shows selectivity for the target ssDNA in a linear range from target ssDNA concentrations of 100 pM to 25 nM. With its excellent detection capabilities, this sensor platform is promising for detection of specific biomarkers and other targeted proteins.

Keywords – Nanowire biosensor, APTES, ssDNA, DNA, Photolithography, Liquid gate control

Corresponding Author: Uda Hashim
Corresponding Author’s Email: uda@unimap.edu.my

Full text: PDF

Fully Depletion of Advanced Silicon on Insulator MOSFETs

March 27, 2015 By Editor

Abstract – Scaling of the transistor has been tremendous successful in the beginning with reduction of the
gate oxide thickness and increase of doping concentration. Moving into smaller dimension,
those are not enough to overcome the short channel effect. Starting with changing in
materials and followed by device architecture is needed which require fully depletion
operation. This article reviews the fully-depletion operation of thin body of silicon on
insulator of advanced MOSFETs.

Keywords – fully-depletion, SOI MOSFETs, thin-body and thin-buried oxide (UTBB)

Corresponding Author: Mohd Khairuddin Md Arshad
Corresponding Author’s Email: mohd.khairuddin@unimap.edu.my

Full text: PDF

Fabrication of Silicon Nanowires Array Using E-beam Lithography Integrated with Microfluidic Channel for pH Sensing

March 25, 2015 By Editor

Abstract – Silicon nanowires based biosensors have garnered great potential in serving as highly sensitive, label-free and real-time response biosensing application. These biosensors are useful in detecting pH, DNA molecules, proteins and even single viruses. In this paper, we report the geometrical characteristics and performance of silicon nanowires array for pH level detection. The nanowires are designed for 40 nm, 50 nm and 60 nm diameter sizes. Top-Down Nanofabrication (TDN) is utilized in the development of resist mask and nanowires formation from silicon on insulator (SOI) wafer involving scanning electron microscope (SEM) based electron beam lithography (EBL). The smallest silicon nanowires structure achieved is 40 nm width and 30 nm height. The corresponding source and drain are fabricated via two aluminum (Al) electrodes on top of the silicon nanowires array using conventional lithography process. A 100 µm microfluidic channel is attached on the silicon nanowires for the sample solution transportation. pH level detection are performed based on several types of standard aqueous pH buffer solutions (pH 4, pH 7, pH 10 and pH 12) to test the electrical response of the sensor. Morphological and electrical responses have been proposed to verify the characteristics of the silicon nanowires array based pH sensor.

Keywords – Array, E-beam lithography, microfluidic channel, pH sensor, silicon nanowires

Corresponding Author: Mohd Khairuddin Md Arshad
Corresponding Author’s Email: mohd.khairuddin@unimap.edu.my

Full text: PDF

Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years

March 25, 2015 By Editor

Abstract – The objective of this review is to study the evolution and key findings and critical technical challenges, solutions and future trend of bonding wires used in semiconductor electronics. Evolutions of bonding wires from Au to Cu and till the most recent silver (Ag) wire (perspective over 25 years packaging technology) have been discussed in this paper. The reliability performances of Au wire bonding, technical barriers of Cu wire bonding and corrosion mechanisms of Cu ball bonds are analyzed and covered. We focus on the influence of a variety of factors that have been reported recently, including reliability performance, wear out reliability performance that determine the selection of bonding wires to reach for developing high reliability of bonded devices. In the end of this review, the evolutions and future trends of bonding wires are compared and illustrated, which have marked
effect based on the materials properties as well as reliability of wire types.

Keywords – bonding wires, semiconductor electronics, packaging technology

Corresponding Author: Uda Hashim
Corresponding Author’s Email: uda@unimap.edu.my

Full text: PDF

Persidangan Kepimpinan Wanita Ke-5 2015

March 13, 2015 By Editor

Persidangan Kepimpinan Wanita Ke-5 akan berlansung pada 18 dan 19 Mac 2015 bertempat di Istana Hotel, Kuala Lumpur.

Sebahagian daripada penceramah jemputan:

Dr Ruslinda Abd Rahim,Timb. Dekan :Research Management & innovation Centre,Universiti Malaysia Perlis
Dato’ Hafsah Hashim,Ketua Pegawai Eksekutif :SME Corporation Malaysia
Betty Yeoh,Programmes Manager :All Women’s Action Society
Nuraizah Shamsul Baharin, Pengarah Urusan : Madcat World Sdn Bhd
Dato’ Sabariah Hassan, Ketua Setiausaha : Kementerian Pembangunan Wanita,Keluarga & Masyarakat
Datuk Norida Hamzah,Pengarah Eksekutif : Aerotree Defence & Services Sdn Bhd
Dato’ Hazimah Zainudin, Pengarah Urusan : Hyrax Oil Sdn. Bhd.
Dr. Robiah Bt. Kulop Hamzah, Pengarah Urusan : RKH Motivation & Services

Untuk maklumat lengkap berhubung isi kandungan persidangan & senarai penuh penceramah jemputan sila rujuk lampiran yang disediakan di sini.

Bagi yang berminat untuk menyertai Persidangan Kepimpinan Wanita ke-5 ini bolehlah mengisi borang ini.